CVD thick film diamond
The ultra-hard “CVD thick film diamond” possesses the highest hardness (2.5 x harder than PCD) and the highest resistance to wear of all cutting materials tested.
“CVD thick film diamond” is not economically machinable with traditional grinding technology, which all tool manufacturers currently use. Innovative and unique with laser removal procedures, this ultra-hard cutting material can economically process industrial cutting material. This precisely controlled laser removal is suitable for cutting edges of any geometric shape and 3D micro chip breakers in application with ultra-hard cutting materials using this new procedure, called “laser finish”.
The most commonly used “PCD cutting material” has, in contrast to “CVD thick film diamond”, distinct disadvantages due to its soft metallic binder phase. Numerous trials have shown that the binder phase of the PCD is particularly negatively affected by abrasive particles. The result is a breakout of the diamond crystals due to a reduced anchorage in the cutting material matrix. As a result, diamond is preferably used as a cutting material during the machining of aluminum and magnesium alloys and also non-ferrous metals. The flat diamond segments, which are generally soldered to hard metal supports with a cutting angle of 0Â°, do not allow, however, the chippings that are produced to form and ultimately break down into a transportable form.
Manufacture of CVD-D thick film diamond
Under vacuum at temperatures of about 1200Â°C, hydrogen and methane gas form a plasma under arc excitation. The carbon is extracted here and deposited onto the substrate in diamond. (Without the addition of metallic catalysts.)
The diamond crystals develop into a uniform polycrystalline layer with random crystal orientation on the surface of the support substrate. The cuts for equipping the tool blades are manufactured after laser removal of the layer.
- CVD-Dickfilm Diamant
PCD-CVD-CBN boring bars
PCD-CVD end mill